Samsung, Intel, Ericsson, and IBM are co-developing next-gen chips

The NSF and the four tech giants will work on a “co-design” basis across different fronts to develop the next-gen chips. Samsung, Ericsson, IBM, and Intel will join forces and work hand-in-hand on areas including device performance, chip and system level, recyclability, environmental impact, and manufacturability.

According to NSF Director Sethuraman Panchanathan: “Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors.” (via EENews Europe)

Through the $50 million funding, the NSF aims for this partnership between Samsung, Ericsson, IBM, and Intel to “inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce.”

This initiative is a part of NSF's Future of Semiconductors (FuSe) Teaming Grants. According to the program, progress in developing new processes, materials, devices, and architectures has been hindered by independent development. The program sees a great opportunity in advancing computing technologies and reducing their cost of application through co-development. “The goal […] is to cultivate a broad coalition of researchers from across science and engineering communities.”

The foundation believes that a holistic, co-design approach can accelerate the development of “high-performance, robust, secure, compact, energy-efficient, and cost-effective solutions.”

Samsung is one of the most impactful semiconductor manufacturers in the world, and it seems only natural that the tech giant has agreed to this initiative to co-develop next-generation chips. Exactly when the consumer and enterprise markets will see the fruits of these collaborations for next-gen computing technologies is to be determined.