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Samsung talks chip manufacturing roadmap at Foundry Forum 2023

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Last updated: October 20th, 2023 at 10:47 UTC+02:00

Samsung hosted the Foundry Forum 2023 in Europe yesterday, October 19, and the company had some interesting things to say about its chip manufacturing roadmap for future advanced technologies, including 2nm, which might not be coming as soon as market watchers and rumors predicted.

According to Samsung at the Foundry Forum 2023, the company will complete preparations for mass production of 2nm chips in 2026. Now, as you might recall, a recent report suggested that both Samsung Foundry and TSMC aim to have the ability to mass produce 2nm chips in 2025 and that Samsung might beat TSMC to the punch.

It turns out that 2nm chips might not go into mass production before 2026. Samsung might still produce its first 2nm chip in 2025, but mass manufacturing could happen the following year.

Story continues after the video

Samsung is preparing for next-gen automotive semiconductors

At the Samsung Foundry Forum 2023 in Europe, the company also confirmed its plans for eMRAM technology, which is a next-generation core memory semiconductor designed specifically for automotive. eMRAM can operate with stability and offer fast read and write speeds even at high temperatures.

Although Samsung was the semiconductor industry's first to mass-manufacture eMRAM chips on the 28nm FD-SOI (Full Depletion Silicon On Insulator) process in 2019, it is currently developing 14nm-based eMRAM using the FinFET process.

Samsung intends to finish development on 14nm eMRAM in 2024. Then, the tech giant aims to advance eMRAM to 8nm in 2026 and 5nm in 2027. The company also discussed its plans to develop 90-nano full-length BCD in 2025, which should reduce the chip area by roughly 20% compared to 130-nano.

Foundry Forum 2023 also served as a place for SAFE (Samsung Advanced Foundry Ecosystem) partners to share their latest developments. And through its MDI (Multi-Die Integration) Alliance, which comprises 20 partners, including SAFE partners, Samsung said it wants to develop differentiated 2.5D and 3D package solutions for applications such as battlefield and high-performance computing.

Image credit: Samsung

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