After heating and throttling issues surrounding Samsung-manufactured chips like the Snapdragon 888 and Snapdragon 8 Gen 1, Qualcomm awarded the production of the Snapdragon 8+ Gen 1 and the Snapdragon 8 Gen 2 to TSMC. This was a big loss for Samsung’s foundry business, but it looks like the company will soon get a chance to make Qualcomm’s high-end chipsets once again.
According to a report from BNext, Samsung Foundry will manufacture some Qualcomm Snapdragon 8 Gen 3 chipsets on its 3nm GAA (GAAFET) node. The majority of the chips will be manufactured by Taiwanese firm TSMC, though, using its 3nm FinFET process. This is reportedly due to TSMC’s higher yield of around 75-80% per wafer. Reports indicate that Samsung’s yield for its 3nm chips is around 60-70%. It is rumored that the South Korean firm’s yield was a measly 20% per wafer before it partnered with the US-based semiconductor firm Silicon Frontline Technology.
Qualcomm and other chip makers (or developers/designers) usually pay semiconductor foundries (manufacturers) per wafer. It means that the higher the yield, the lower the price per chip. If the yield is low, they have to charge their customers higher, which increases the cost of the device. Higher costs could also lead smartphone manufacturers to other chip makers.
Since Samsung Foundry is applying its GAA (Gate All Around) technology for the first time for chip fabrication, production is reportedly not as efficient. However, chips that use the GAA technology are said to feature better power efficiency and thermals than those using the FinFET design. It remains to be seen how well Samsung can compete with TSMC in the 3nm race, but it will still be great for Samsung to be in the mix. Apple’s A17 chipset is rumored to be made using TSMC’s 3nm process, while Google’s Tensor G3 could be a 3nm chip made by Samsung.
