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Qualcomm and MediaTek flagship chips to use TSMC’s 3nm tech, not Samsung’s

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Last updated: November 22nd, 2023 at 16:28 UTC+01:00

AMD, Apple, MediaTek, Nvidia, and Qualcomm have all been using TSMC's new fabrication technologies to make their new semiconductor chips. While some of them also use Samsung Foundry to make their chips, they are usually not the flagship models. Samsung Foundry was hoping that some of them would switch from TSMC to its 3nm process, but it doesn't look like that's happening anytime soon.

Snapdragon 8 Gen 4 and MediaTek Dimensity 9400 could be made using TSMC's 3nm process

It was rumored that Qualcomm could use both Samsung Foundry's and TSMC's 3nm processes for the Snapdragon 8 Gen 4 in 2024. However, a new report from China Times claims that both MediaTek and Qualcomm plan on using TSMC's second-generation 3nm process (N3E) to fabricate the Dimensity 9400 and the Snapdragon 8 Gen 4. This new technology will offer performance and efficiency improvements compared to the N3B (first-generation 3nm) process that Apple is currently using to make its A17 Pro processor for the iPhone 15 Pro series.

A few months ago, a report claimed that TSMC's first-generation 3nm process (N3B) had a yield of 55%, and one wafer containing multiple chips costs $20,000. Yield refers to the actual percentage of a wafer's area that could be turned into an individual chip with no defect. Usually, chip manufacturers charge their clients irrespective of the yield. However, TSMC reportedly offered a sweet deal to Apple for its N3B process, where it would absorb the cost of defective wafers.

TSMC is reportedly producing 60,000 to 70,000 wafers per month using its 3nm process, and that number is expected to rise to 100,000 wafers by the end of next year. Currently, 5% of its revenue comes from its 3nm process, but that is set to rise to 10% next year.

Samsung Foundry hasn't received any big clients for its 3nm chip fabrication tech yet

Samsung Foundry is hoping to upend its image and defeat TSMC by 2030 with advanced technologies. It uses a new transistor design called GAA (Gate All Around) that is said to be more power efficient than FinFET, which TSMC uses in its 3nm process. However, it hasn't received any big clients for its tech yet. It is rumored that AMD and Qualcomm could use Samsung's newer-generation 3nm and 4nm processes to fabricate some of their chips in the near future, but there is nothing concrete on that matter yet.

System LSI (Samsung's chip designing arm) is said to be developing a brand-new Exynos 2500 processor that is said to be a lot more efficient than previous Exynos chips. In fact, it is usually referred to as the company's “Dream Chip,” and it could be the first complex chip that will be made using Samsung Foundry's second-generation 3nm (3GAP) process. It could be launched late next year.

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