Galaxy S22 Ultra could run way cooler thanks to new heat transfer tech

The new S Pen flagship features a new cooling solution comprising several upgraded elements. To begin with, the Galaxy S22 Ultra uses a new thermal paste that's capable of transferring heat 3.5x more efficiently. Samsung calls it ‘Gel-TIM.'

Above it is ‘Nano-TIM,' i.e., a component that shields electromagnetic interference. It transfers heat to the vapor chamber more efficiently, and it's more resistant under pressure than similar solutions used previously.

All this could mean better sustained performance

The overall design is also apparently new. The vapor chamber used to rest on the PCB (printed circuit board), but now it covers a wider area from the AP (application processor) to the battery, which improves heat transfer.

The vapor chamber is double-bonded stainless steel, so it's both thinner and more durable. The cooling solution ends in a wide graphite sheet which diffuses heat away from the vapor chamber.

It will be interesting to see how all this translates into the real world. Better cooling usually means that a chipset can perform at maximum capacity for longer sessions, and Samsung's Exynos chipsets have had their shortcomings in this area. So, a new cooling solution combined with the latest AMD graphics inside the Exynos 2200 package sounds very promising. Stay tuned for our reviews.

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