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Here you will find the latest news and most recent developments on the HBM, with regular updates and all the information you need.
Samsung, the world leader in semiconductor memory chips, has announced that it has developed the industry's first 12-stack HBM3E DRAM chip. It is the world's highest-capacity HBM memory chip to date, and the company claims that it offers 50% higher capacity and performance than previous-generation HBM memory chips. Samsung unveils industry's first 36GB HBM3E DRAM […]
Last week, it was revealed that OpenAI CEO Sam Altman visited South Korea to meet executives from Samsung Electronics and SK Hynix for a possible alliance for AI chips. It has now been revealed that he visited Samsung's semiconductor chip plant in the country, and it is possible that OpenAI will develop its own chips […]
Samsung unveiled its HBM3E memory called Shinebolt during its Memory Tech Days 2023 event. The company's HBM3E memory is an upgrade over the current HBM3 memory and offers new benchmarks for memory bandwidth and speed. It is meant to be used with high-end processors and GPUs for servers and high-end computing. The company also unveiled […]
When Samsung Foundry announced last year that it started the mass production and shipments of 3nm chips, it didn't reveal the name of its first client for the latest-generation node. Several reports claimed it was making 3nm ASIC chips for cryptocurrency mining firms. Now, the company seems to have received another client. According to reports, […]
Samsung, one of the world's leading semiconductor foundries, will make AI chips for Rebellions. Rebellions is a South Korean AI semiconductor startup, and its partnership with Samsung Foundry is crucial for the local semiconductor segment as it will boost the country's importance on the world stage. Rebellions' next-gen AI semiconductor chip will be made using […]
Samsung is going through one of its most challenging times. The company's over-reliance on its semiconductor chip business has almost brought it down to its knees in the second quarter of this year. The South Korean firm's memory chip business posted a loss for the first time since its inception. However, it is still the […]
Samsung Foundry has announced that its latest 2.5D semiconductor chip packaging technology H-Cube is now available for its foundry clients. H-Cube, which was developed in collaboration with Samsung Electro-Mechanics and Amkor Techology, allows complex logic and HBM (High-Bandwidth Memory) chips to be packed in compact sizes. The South Korean firm said that its new packaging […]
Samsung, the current world leader in memory chips, has announced that it has increased the production of 8GB HBM2 memory chips. HBM2 (second-generation High Bandwidth Memory) chips are used in high-end computers and servers for artificial intelligence, advanced graphics, high-performance computing, and network systems. HBM2 offers a data bandwidth of 256GB/s, and is currently the fastest […]