Samsung Electronics began the mass production of the 3nm chip on June 30. The company has now scheduled a launching ceremony on July 25, where it will unveil the 3nm chips, the most advanced semiconductor in the world.
These 3nm chips are based on the Gate-All-Around (GAA) transistor architecture and are all set to be unveiled to the world a month after their mass production began in June.
Samsung is rushing to beat TSMC
BusinessKorea reports that the first batch of the 3nm chips will be delivered to a Chinese cryptocurrency miner. According to multiple Japanese and Taiwanese news outlets, Samsung isn’t relying much on its Chinese cryptocurrency client in the long run because of the current state of the cryptocurrency market.
According to Pulse News Korea, the first 3nm shipment ceremony will be held in the Hwaseong chip manufacturing center in Gyeonggi province on July 25. Moreover, the first batch being produced at Hwaseong implies a small scale of production because Samsung has its finest equipment and technology located in Pyeongtaek.
This ceremony will be attended by Lee Chang-yang, minister of Korea’s Ministry of Trade, Industry and Energy, and Kyung Kye-Hyun, President and CEO of Samsung’s Device Solution Division. Samsung is also eyeing to start the production of second-gen 3nm chips by 2023 and 2nm chips by 2025, solely to catch up with the Taiwanese semiconductor giant TSMC.
TSMC plans to start FinFET-based 3nm chip manufacturing either later this month or in August. It may start manufacturing chips based on the GAA tech in 2025. Samsung’s 3nm tech is more advanced than TSMC’s FinFET.
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