Lin Jun-cheng, an ex-TSMC employee, has been appointed Senior Vice President of Samsung’s Advanced Packaging Team, part of the tech giant’s Device Solutions division. According to a report from Korea Herald, the primary task for Jun-cheng is likely to center around the growth of advanced packaging technology, a catalyst to augment high-performance chipsets.
Jun-cheng, who had a 19-year-long tenure at Samsung’s foundry business rival TSMC, played an essential part in the development of 3D packaging technology. Before his employment at TSMC, Lin worked for Micron Technology in the United States, a company specializing in memory semiconductors. Subsequently, before joining Samsung, he served as the Head of Skytech, a semiconductor equipment company in Taiwan.
Samsung’s making strategic hires to strengthen its position in advanced chip manufacturing industry
Samsung’s recruitment of Lin has come at a time when the company has devoted considerable resources to advanced packaging technology, a field in which the majority of its competition originates from TSMC. As an example, despite the South Korean giant’s pioneering reputation for manufacturing 3nm chips, Apple selected TSMC to manufacture its forthcoming M3 and A17 Bionic chips. It is also worth noting that Qualcomm’s upcoming Snapdragon 7+ Gen 1 will be manufactured using TSMC’s 4nm process instead of the Samsung 4nm Low Power Early (LPE) process that was used for the creation of the Snapdragon 7 Gen 1 or the 8 Gen 1.
Last year, Samsung made two prominent strategic hires to enhance its already dominant position in the industry. Kim Woo-pyeong, formerly of Apple, was recruited as head of its Packaging Solution Center in Device Solution division. Benny Katibian, a self-driving chip technology expert who previously worked as vice president at Qualcomm, was picked to help enhance Samsung’s self-driving tech. And if that weren’t enough, the tech juggernaut also hired Kwon Jung-hyun, a former Nvidia engineer, to take on robotics research.
