Samsung preparing new products to protect its chip stacking dominance

This will enable the company to lead its rivals as the industry transitions to high-stacking and high-density flash memory. The V9 NAND is going to succeed Samsung's existing flagship 236-layer V8 NAND products.

Samsung aims to cash in on NAND's major recovery this year

The V9 NAND chips will primarily be used in large-scale enterprise servers, AI, and cloud solutions. Samsung is using its innovative double-stack technology for V9 NAND modules.

According to reports, Samsung will also be launching 430-layer NAND chips next year to meet demand for high-performance and large storage devices. The AI gold rush has led to an increase in demand as well as an increase in price for these memory products.

These 10-generation NAND chips are expected to be unveiled in the second half of next year. Samsung will reportedly use its triple-stack technology to develop these modules. Technical limitations necessitate the use of triple-stack technology to make such advanced chips.

The NAND flash market is expected to grow 38.1% this year and Samsung's looking to cash in on that. Rivals like SK Hynix are also launching their high-density NAND chips, with SK Hynix planning to mass produce its 321-layer NAND products in early 2025. Chinese memory manufacturers are also catching up. Yangtze Memory has started producing 232-layer NAND chips and is also planning to launch its 300-layer chips later this year.