Samsung's HBM3E 12H advanced memory chips have received high praise from NVIDIA CEO Jensen Huang recently. He confirmed that the company is testing these new memory models for integration into its GPUs, as unrelenting demand continues for its products.
Such is the nature of the close collaboration between these two titans of the industry that Huang made a visit to Samsung's booth at NVIDIA's GTC 2024 conference and literally signed his approval on Samsung's latest high bandwidth memory module.
NVIDIA CEO Jense Huang gives his stamp of approval to Samsung's HBM3E
NVIDIA CEO Jensen Huang stopped by Samsung's both at the GTC 2024 and left behind his signature on the display installation for the HBM3E 12H memory from Samsung. The company has been displaying its high bandwidth memory solution at NVIDIA's conference this week.
The photo was shared by Han Jin-man, who oversees Samsung's semiconductor and device solutions business in the Americas, showing Huang at the booth and his signature accompanying the “JENSEN APPROVED” seal on the HBM3E 12H product. In a post on LinkedIn, Han expressed his gratitude to Han for visiting the booth and also his pleasure at his gesture of leaving his signature on the HBM3E product.
This gesture has poured fuel on whispers in the industry regarding a partnership between NVIDIA and Samsung. Huang's comments the previous day, in which he sung high praise for Samsung's HBM3E product, only helped add to those rumors.
An in-person visit from the NVIDIA CEO to the booth is a major gesture which highlights the importance that NVIDIA attaches to its relationship with Samsung Electronics. Samsung's HBM3E marks an industry-first 12-layer stacked high bandwidth memory that NVIDIA is now conducting validation testing on.
