Samsung partners with Japanese carrier KDDI for 5G network slicing

KDDI and Samsung Networks signed an MoU (Memorandum of Understanding) yesterday after conducting a field trial in January 2023. This field trial was conducted on a live 5G SA (Standalone) network in Tokyo, Japan, and it achieved SLA (Service Level Agreements). The companies had also demonstrated network slicing RAN Intelligent Controller (RIC) back in 2020. The network slicing market is expected to grow 50% annually from 2023 to 2030.

Network slicing is a technology that creates multiple virtual networks (slices) on a single physical network infrastructure. Each of those slices can be assigned to a specific application or service. For example, a slice of the network can be dedicated to low-latency applications such as automated vehicles, while other slices can be dedicated to IoT devices. A high-bandwidth slice can be dedicated to video streaming services and so on and so forth. This improves network quality and accelerates the delivery of applications.

Toshikazu Yokai, Chief Network Officer at KDDI, said, “KDDI has been at the forefront of network slicing innovation, and we are excited to take another significant step forward with Samsung to show how this technology can augment 5G experiences for consumers and businesses. Through the strategic alliance, we not only aim to create new and immersive use cases, but also explore the infinite potential in transforming industries.”

Samsung Networks is Samsung Electronics' telecommunications and networking equipment manufacturing business. It makes 5G chips, 5G Core, vRAN, Open RAN, and AI-powered automation tools for telecom networks. It supplies this networking gear to various high-profile mobile carriers across the world.