Samsung wants to bring flagship-grade experiences to non-flagship phones through its latest LPDDR5 UFS-based multichip package (uMCP). Samsung announced today that the industry’s first LPDDR5 uMCP solution enters mass production starting this month before being deployed across “mid-to-high-end smartphones.”
The module leverages Samsung’s expertise in semiconductor technology and combines Samsung’s fastest LPDDR5 memory with UFS 3.1 NAND storage in a single package. Samsung claims that the solution delivers flagship-level performance and enables uninterrupted streaming, gaming, and mixed reality experiences “even in lower-tier devices.”
Fast speed, high storage capacity, and very low energy requirements
Samsung’s LPDDR5 uMCP promises almost a 50% increase in DRAM performance and 2x NAND flash performance over previous LPDDR4x-based UFS 2.2 solutions. The LPDDR5 uMCP boasts 25GB/s transfer rates for DRAM (up from 17GB/s) and a 3GB/s transfer rate for NAND flash, up from 1.5GB/s. The amount of RAM on a uMCP module will vary from 6GB to 12GB, and storage options will include 128GB and 512GB.
All this extra performance comes in a power-efficient compact package that measures 11.5mm x 13mm, leaving extra room for other internal components. The company claims that its upcoming LPDDR5 uMCP solution can meet the requirements of 5G smartphones throughout the mid and high-end segments.
Samsung revealed that it has successfully completed compatibility tests with several global smartphone manufacturers. The LPDDR5 uMCP solution was developed by the company’s semiconductor division, and it won’t be exclusive to Galaxy smartphones. Devices equipped with Samsung’s LPDDR5 uMCP are expected to hit the shelves in key markets later this month.