Samsung seems completely ready to make next-gen flagship memory chips

Samsung, which was the world’s largest memory chipmaker for decades, recently lost its edge in the high-bandwidth memory (HBM) chip segment. This loss of dominance led to rival SK Hynix overtaking Samsung as the market leader a few months ago. However, Samsung is making a swift comeback and now seems fully prepared to begin the production of HBM4 chips.

A report from AjuNews claims that Samsung Device Solutions (DS) has completed the development of sixth-generation HBM (HBM4) chips and has entered the Production Readiness Approval (PRA) phase. PRA is the sixth phase in the semiconductor chip development process and it is the last phase before the mass production stage. It means Samsung is now fully ready to start the mass production of HBM4 chips.

Samsung's HBM4 chips are expected to be 60% faster than fifth-generation HBM (HBM3E) chips. HBM4 is the key component of Google's and Nvidia's next-generation flagship AI accelerators. It will be used in Nvidia's Rubin AI accelerator that is scheduled to launch next year. The South Korean memory chipmaker is currently sending samples of those chips to Nvidia. Samsung can start mass production of HBM4 chips as soon as Nvidia approves their performance.

Samsung is said to be preparing a mass production system for HBM4 chips so that it can start mass production immediately after getting the go-ahead from Nvidia. And the company isn't stopping there. It is already developing a faster version of its HBM4 chip with 40% faster performance than the current version and could be unveiled as early as mid-February 2026.