Samsung's latest cash cow product to be unveiled next week

Semiconductors are a big business for Samsung. The rapid demand for AI hardware has resulted in a soaring need for high-bandwidth memory. While SK Hynix won the current-gen HBM3 race at Samsung's expense, the company is prepared to fight back.

Samsung is reportedly going to unveil its next-generation HBM4 memory at the 2025 Samsung Tech Fair next week. If everything goes according to plan, this product could end up making a lot of money for Samsung.

Samsung turned its focus to HBM4 many months ago as SK Hynix and Micron won the majority of HBM3 orders from the likes of NVIDIA, which has reportedly approved Samsung's 12-layer HBM3E only recently.

Reports out of South Korea suggest that Samsung will unveil its latest 12-layer HBM4 memory chip that's due to enter mass production later this year at the Samsung Tech Fair. it takes place from October 27 through October 31 at the Samsung Semiconductor Complex in Yongin, Gyeonggi Province.

Since the HBM3E lagged behind SK Hynix and Micron in obtaining certifications from NVIDIA, Samsung is likely going to highlight how its latest memory chip has closed the gap in both quality and certification timelines.

In addition to the memory chip, Samsung is also expected to showcase the world's smallest 200-megapixel sensor as well as its semiconductor-focused AI advancements at the event.

The DX division will reveal a 115-inch Micro RBG TV to showcase competitiveness against the rising competition from Chinese manufacturers in this space. Samsung Research is expected to detail its vision for the Galaxy ecosystem powered by on-device AI agents.