A leaked Galaxy S9 Android Pie build has dropped hints about a couple of the company's upcoming devices. References to Samsung's first foldable smartphone and Qualcomm's next flagship chip have been discovered in the firmware. It's not like we haven't heard about this before but the mentions within Samsung's firmware is noteworthy.
A decompilation of the framework-res file of this leaked build has yielded files that mention the foldable's smartphones expected codename. Similar files also suggest the marketing name for Qualcomm's next high-end processor.
Leaked Galaxy S9 Android Pie build has hidden references
An earlier report from a reputable source claimed that the company's foldable smartphone has been codenamed “Winner.” A file named “winnerlte” has been discovered in the leaked firmware. This device may be powered by an Exynos chip. Samsung differentiates Snapdragon versions with a “q” at the end of the codename.
Since configuration files for this device have only been discovered in the leaked Android Pie build it's possible that this device may come with Android 9 out of the box. It is as yet unknown when it will arrive and in what markets. Samsung is expected to provide some details about the foldable device at SDC 2018 next month.
A policy file for an unreleased Qualcomm chipset has been discovered in this leaked Galaxy S9 Android Pie build as well. It mentions Snapdragon 8150 as the marketing name for Qualcomm's next flagship ship. It will be the successor to the Snapdragon 845.
Some would have expected it to be called the Snapdragon 855 but it seems like Qualcomm might change the moniker. This policy file will most likely be there for the Galaxy S10 which will be the first Samsung device with this chip.
These mentions within the firmware don't confirm any details about the device or the chip. At most, they can be seen as an indication that these products are being worked on. The Snapdragon 8150 will not arrive before next year and that may also be the case for the foldable smartphone.