Samsung starts mass producing world’s fastest high-bandwidth DRAM chips

Samsung likes to be the first in the world to produce memory and storage products with new technologies. It has now become the first in the world to start mass producing 4GB DRAM chips that are based on fast HBM2 interface, which will help in high-performance computing, gaming, and network systems.

These HBM2-based DRAM chips can sift data at a pace of 256GBps, making them seven times faster than current generation DDR5 DRAM chips. The company said that it will supply these chips to enterprises server manufacturers, who value performance more than anything else.

Samsung said that it will also supply these 20nm-based chips to NVIDIA and AMD, which will help these companies in churning out graphics cards with extremely high-performance and reduced power consumption. Samsung is currently making 4GB modules with four layers of 8-gigabit cores, but it will soon start making 8GB modules with eight layers.

Sewon Chun, senior vice president of Memory Marketing at Samsung Electronics, said, “By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies. Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market.

Samsung 4GB HBM2 DRAM Block Diagram


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