A couple of months back when Qualcomm was yet to fully unveil the Snapdragon 820 it was rumored that the new chipset was also facing overheating issues like its predecessor the Snapdragon 810, Qualcomm was quick to shoot down those rumors and said that the Snapdragon 820 performed well within the parameters. Nevertheless it remains a concern for those who never fully took Qualcomm at its word that the Snapdragon 810 didn’t have any problems with overheating even though there was ample evidence to support the findings.
A new report out of Asia claims that to ensure that the Snapdragon 820 does not cause such problems for the Galaxy S7 Samsung is now seeking internal heat pipe suppliers for its next flagship handset. The company is apparently experimenting with several different types and shapes of heat pipes, it will decide based on these experiments whether or not to include a heat pipe in the Galaxy S7 for the purpose of heat dissipation. This method has already been used in devices like the OnePlus 2 and the Sony Xperia Z5 Premium for this exact same purpose, it really won’t be groundbreaking at all if Samsung decides to do the same with the Galaxy S7. We exclusively confirmed a few months back that Samsung is going to release two models of the Galaxy S7 with variants being powered by either the Exynos 8890 or Snapdragon 820 processor based on the market.