Samsung's big Exynos 2800 upgrades may bring better on-device AI

Reports have already started to emerge about the major changes that Samsung is expected to introduce with the Exynos 2800.

The latest suggests that Samsung is working on next-generation HBM packaging technology which would significantly improve on-device AI for mobile devices.

Samsung is gradually bringing back the Exynos chipsets to its flagship series. The Exynos 2600 has been used in Galaxy S26 models other than the Ultra. We may see a similar Snapdragon/Exynos split for the Galaxy S27 series next year with the Exynos 2700.

Some rumors have also suggested that Samsung could go Exynos-only for its flagship series in a couple of years. This would align with the major upgrades it reportedly has planned for the Exynos 2800.

Earlier reports have suggested that Samsung may use an in-house GPU architecture for the chipset. Some rumors even claim Samsung might use its own custom CPU cores in the Exynos 2800.

A new report out of South Korea claims that Samsung is working on Vertical Cu-post Stack technology which would bring high-bandwidth memory to mobile devices, thereby significantly improving on-device AI. HBMs are widely used in servers currently, bringing the same technology to mobile currently faces size, thickness, power, and thermal performance bottlenecks.

If Samsung is able to address this technical challenge, it would not just deliver a significant boost for mobile AI but also for its memory business, which would gain handsomely by becoming one of the very few memory suppliers capable of providing an HBM solution for mobile.

Whether or not this is realized by the time the Exynos 2800 comes to market remains to be seen. Given that this chipset is expected to be a significant upgrade, if the stars align by then, Samsung would most likely introduce this capability with the Exynos 2800.