SamMobile has affiliate and sponsored partnerships. If you buy something through one of these links, we may earn a commission. Learn more.

Samsung, Intel and TSMC join hands for next-gen chip packaging tech


Last updated: March 3rd, 2022 at 18:29 UTC+02:00

Nikkei Asia reports that Samsung, Intel, and TSMC are joining hands to establish an advanced chip-packaging and stacking technology. This advanced technology will be used to develop next-generation and more powerful electronic devices. This is important because, all three, i.e., Samsung, Intel, and TSMC, are the world’s three largest semiconductor manufacturing companies.

And their joining forces indicates that something incredible is on the way. Not only are these three huge chip players, but companies like AMD, Qualcomm, and Arm, as well as Google Cloud, Meta, and Microsoft are also collaborating in this consortium. ASE Technology Holding, which is the world’s biggest provider of chip packaging and testing services, will also join the bandwagon.

The aimis to create an industry standard for chip packaging and stacking

Such mega-companies joining hands shows how important chip packaging and sorting have become. We already know how the semiconductor shortage across the globe is delaying product launches. To sort of overcome this, all these giants are coming together to set a standard for chip packaging and stacking.

Notably, chip packaging is the last step in semiconductor manufacturing. Because just before packaging, chips are mounted onto printed circuit boards and then embedded into electronic devices. The best part about this collaboration is that it is open to more companies joining.

But there are limitations to the number of transistors that can be fit into a chip. So, companies are picking their brains and trying to evaluate new combinations for chip packaging and stacking. These chip combinations, called “Chiplets” require new packaging standards, which this consortium plans to call “Universal Chiplet Interconnect Express (UCIe)”.

Join SamMobile’s Telegram group and subscribe to our YouTube channel to get instant news updates and in-depth reviews of Samsung devices. You can also subscribe to get updates from us on Google News and follow us on Twitter.

Business QualcommSamsungTSMC
Load 0 comments

You might also like

Galaxy Watch 5 will get competition from OPPO’s Watch 3 with Snapdragon W5 Gen 1 chip

Last year, the Galaxy Watch 4 was the only smartwatch running the brand new Wear OS 3 software, and Samsung had the monopoly in the Android smartwatch space. This year, though, things will be different. To compete with the Galaxy Watch 5 series, rival smartwatch brands are in the process of launching their new Wear […]

  • By Asif Iqbal Shaik
  • 1 week ago

Samsung Galaxy S23 Ultra battery and chipset details leak

The Galaxy S22 Ultra had the difficult task of joining the best of the Galaxy S and Note lineups into one device. The upcoming Galaxy S23 Ultra won’t be as big of a generational leap but should refine the current design formula. Similarly, some hardware components will get replaced and upgraded, while others won’t. Samsung […]

  • By Mihai Matei
  • 2 weeks ago

As US China tensions flare over Taiwan, Samsung becomes indispensable

The world can hardly afford another conflict. The uncertainties of the past couple of years have led to significant turmoil across the globe. A post-COVID scenario seems elusive as the virus continues to mutate and go through periods of resurgence. The economic recovery following the pandemic has been painfully slow. The armed conflict between Russia […]

  • By Adnan Farooqui
  • 2 weeks ago

SamMobile Podcast Episode 17: Are Exynos chipsets going away?

It’s Friday, and we have another SamMobile Podcast ready for our readers and YouTube / Spotify subscribers. As usual, for Episode 17, we’re recapping some of the most exciting news of the week. And what a week it was?! Samsung and Qualcomm have extended their chipset license agreement to 2030, and this could mean big […]

  • By Mihai Matei
  • 3 weeks ago

Samsung and Qualcomm have extended their chipset partnership to 2030

Qualcomm announced today that it has agreed to extend its patent license agreement with Samsung for another seven years. The agreement’s renewal guarantees that future Galaxy devices and Samsung PCs will be powered by Qualcomm technologies such as chipsets and networking equipment through the end of 2030. More specifically, Samsung and Qualcomm have extended their […]

  • By Mihai Matei
  • 3 weeks ago

Qualcomm confirms Snapdragon exclusivity for Galaxy S23, future devices

It was rumored earlier this year that the Galaxy S23 might only use Snapdragon chipsets. The company has previously used a mix of Qualcomm Snapdragon and its Exynos chipsets for these flagship phones. That might change for good next year. Qualcomm has effectively confirmed that the Galaxy S23 will exclusively be powered by Snapdragon chipsets. […]

  • By Adnan Farooqui
  • 3 weeks ago