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Samsung, Intel and TSMC join hands for next-gen chip packaging tech

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Last updated: March 3rd, 2022 at 18:29 UTC+02:00

Nikkei Asia reports that Samsung, Intel, and TSMC are joining hands to establish an advanced chip-packaging and stacking technology. This advanced technology will be used to develop next-generation and more powerful electronic devices. This is important because, all three, i.e., Samsung, Intel, and TSMC, are the world’s three largest semiconductor manufacturing companies.

And their joining forces indicates that something incredible is on the way. Not only are these three huge chip players, but companies like AMD, Qualcomm, and Arm, as well as Google Cloud, Meta, and Microsoft are also collaborating in this consortium. ASE Technology Holding, which is the world’s biggest provider of chip packaging and testing services, will also join the bandwagon.

The aimis to create an industry standard for chip packaging and stacking

Such mega-companies joining hands shows how important chip packaging and sorting have become. We already know how the semiconductor shortage across the globe is delaying product launches. To sort of overcome this, all these giants are coming together to set a standard for chip packaging and stacking.

Notably, chip packaging is the last step in semiconductor manufacturing. Because just before packaging, chips are mounted onto printed circuit boards and then embedded into electronic devices. The best part about this collaboration is that it is open to more companies joining.

But there are limitations to the number of transistors that can be fit into a chip. So, companies are picking their brains and trying to evaluate new combinations for chip packaging and stacking. These chip combinations, called “Chiplets” require new packaging standards, which this consortium plans to call “Universal Chiplet Interconnect Express (UCIe)”.

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