Galaxy S25 FE cooling: Find out how it's better!

Samsung has just unveiled its new Fan Edition phone, the Galaxy S25 FE. It features a thinner and lighter body, an improved front-facing camera, a bigger battery, and faster performance. But how well can it perform under sustained loads?

The Galaxy S25 FE, which features the Exynos 2400 processor and 8GB of RAM, features a 13% bigger vapour chamber system with a liquid thermal material. It should help tame the Exynos chip by dissipating the heat faster compared to the Galaxy S24 FE's vapour chamber system.

The Exynos 2400 chip, which debuted with the Galaxy S24 series last year, has a 10-core CPU and the Xclipse 940 GPU with AMD Radeon graphics processing architecture. The chip's prime CPU core is clocked at 3.2GHz, which is slightly higher than clock speed of the prime CPU core inside the Exynos 2400e chip that was used in the Galaxy S24 FE.

A vapor chamber system consists of heat pipes and liquid. When the processor heats up, the water inside the vapor chamber system gets converted into steam and travels to the far end of the system and then cools down to become water and releases the absorbed heat which is then dissipated through the phone's body. Most smartphones these days use a similar system.