Future Exynos chips could run even cooler, thanks to Samsung's new tech

Flagship Exynos chip for 2026 could be even cooler

The South Korean firm is reportedly trying to improve heat dissipation on its chips. According to a report from TheElec, Samsung seems to be developing a new semiconductor chip packaging technology called Fan-Out Wafer Level Packaging Heat Patch Block (FOWLP-HPB). It is reportedly developed by Samsung's Advanced Package (AVP) team.

This technology is already used in servers and PCs, but Samsung is trying to bring it to smartphone application processors, as AI processing and the need for higher performance are pushing their limits. The development of this new technology will reportedly be completed by the end of this year, and it could be ready for the mass production phase.

If Samsung decides to use it, it could be ready for its flagship Exynos chip in 2026, as the Exynos 2500 (tentative name) for the Galaxy S25 would already be in the mass production phase in the fourth quarter of this year.

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Some smartphones use vapor chambers for better heat dissipation, but FOWLP-HPB will improve heat dissipation even further. Moreover, the company is also trying newer materials for chip packaging. It is also said to be working on an even better technology called FOWLP-System-in-Package (FOWLP-SiP), which is considered better than FOWLP-HPB.

Hopefully, Samsung will be able to solve its chips' overheating issues completely and be on par with rival chips from Apple, MediaTek, and Qualcomm.