Ever since there have been rumors that Samsung might bring the Exynos chipset back for its flagship phones next year, fans are understandably concerned if it’s going to address the issues that made Exynos chipsets lag behind their Snapdragon counterparts for many years.
The signs are pointing towards a return of the Exynos. We’ve exclusively reported that the Galaxy S23FE due later this year will be powered by Exynos. Rumors have also surfaced about the Exynos 2400 being developed for the Galaxy S24. A new rumor claims that Samsung plans to make an important change to how its chipsets are put together in order to make the Exynos 2400 better.
Samsung could change the way it makes Exynos chipsets
Rumor has it that Samsung is planning to utilize FoWLP (Fan-out Wafer Level Packaging) for the Exynos 2400. FoWLP refers to the method utilized for enclosing all of the integrated circuits. The package also protects the die and connects the chipset to the motherboard.
FoWLP delivers a higher integration level in a smaller package footprint. The input/out I/O is also higher with significantly improved thermal and electrical performance. In simple words, this means that if FoWLP is utilized to make the Exynos 2400, the chipset will be smaller yet more powerful as well as more power efficient, at least in theory.
This should help the Exynos 2400 be at par with the superior optimization and power efficiency that have been a hallmark of its Snapdragon counterparts. Samsung could squeeze further optimization through the other components and its software to deliver a significantly better Exynos-powered variant.
Whether this ends up happening is anybody’s guess right now. Samsung hasn’t even acknowledged at this stage that the Exynos 2400 exists, let alone reveal anything about the packaging process used to make the chipset. So take this rumor with a grain of salt for now.