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Last updated: September 21st, 2015 at 09:02 UTC+02:00
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High bandwidth memory is basically a high performance RAM interface with DRAM modules stacked up in four layers. Through Silicon Via (TSV) technology enables these stacked memory chips to process data 4 to 8 times faster than conventional DDR memory while consuming up to 40% less power. Second-gen chips are expected to process data twice as fast as their predecessors which were first unveiled by SK Hynix in late 2013, while the storage capable of the 8GB chips is said to have increased fourfold.
Adnan Farooqui is a long-term writer at SamMobile. Based in Pakistan, his interests include technology, finance, Swiss watches and Formula 1. His tendency to write long posts betrays his inclination to being a man of few words.
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