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Last updated: January 19th, 2016 at 12:59 UTC+01:00
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These HBM2-based DRAM chips can sift data at a pace of 256GBps, making them seven times faster than current generation DDR5 DRAM chips. The company said that it will supply these chips to enterprises server manufacturers, who value performance more than anything else.
Samsung said that it will also supply these 20nm-based chips to NVIDIA and AMD, which will help these companies in churning out graphics cards with extremely high-performance and reduced power consumption. Samsung is currently making 4GB modules with four layers of 8-gigabit cores, but it will soon start making 8GB modules with eight layers.
Sewon Chun, senior vice president of Memory Marketing at Samsung Electronics, said, “By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies. Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market.”
Asif is a computer engineer turned technology journalist. He has been using Samsung phones since 2004, and his current smartphone is the Galaxy S21 Ultra. He loves headphones, mechanical keyboards, and PC hardware. When not writing about technology, he likes watching crime and science fiction movies and TV shows.
